cystech electronics corp. spec. no. : c335c2 issued date : 2013.02.05 revised date : page no. : 1/6 BAS21C2 cystek product specification high voltage switching diode BAS21C2 description high voltage switching diode encapsulated in a sod-523 small plastic smd package. features ? fast switching speed ? low forward voltage drop ? small plastic smd package ? pb-free lead plating package mechanical data ? case: molded plastic, jedec sod-523. ? terminals: solder plated, solderable per mil-std-750 method 2026 ? polarity: indicated by cathode band. ? mounting position : any. symbol outline
cystech electronics corp. spec. no. : c335c2 issued date : 2013.02.05 revised date : page no. : 2/6 BAS21C2 cystek product specification absolute maximum ratings (t a =25 , unless otherwise noted) parameters conditions symbol min typ max units repetitive peak reverse voltage v rrm 300 v rms voltage v rms 210 v continuous reverse voltage v r 300 v continuous forward current i f 250 ma repetitive peak forward current tp=1ms, duty 0.25 i frm 1 a non-repetitive peak forward current t=1 s i fsm 4.5 a t a =25c (note 1) 250 total device dissipation t sp 90 c (note 2) p d 500 mw junction to ambient (note 1) r t ja 500 thermal resistance junction to soldering point (note3) r jsp 120 qc/w storage temperature range tstg -65 150 qc operating junction temperature range tj -55 150 qc note :1.parts mounted on fr-5 board with minimum pad, in free air. 2.tsp is the solder point temperature at the soldering point of the cathode tab. 3.soldering point of cathode tab. characteristics (ta=25 q c) characteristic symbol condition min. max. unit reverse breakdown voltage v br i r =100 a 300 - v v f (1) i f =100ma - 1 v forward voltage (note) v f (2) i f =200ma - 1.25 v i r (1) v r =250v,tj=25 - 150 na reverse leakage current (note) i r (2) v r =250v,tj=150 100 a diode capacitance c d v r =0v, f=1mhz - 5 pf reverse recovery time t rr i f =i r =30ma rl=100 : measured at i r =3ma - 50 ns notes : pulse test, tp=300 s, duty cycle<2%. ordering information device package shipping BAS21C2-0-t5-g sod-523 (pb-free lead plating an d halogen-free package) 8000 pcs / tape & reel
cystech electronics corp. spec. no. : c335c2 issued date : 2013.02.05 revised date : page no. : 3/6 BAS21C2 cystek product specification typical characteristics forward current vs forward voltage 0.1 1 10 100 1000 0 0.3 0.6 0.9 1.2 1.5 forward voltage---vf(v) instantaneous forward current---if(ma) pulse width=300s 25c 75c 100c 125c 150c reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 0 50 100 150 200 250 reverse voltage---vr(v) reverse leakage current---ir(a) 100 75 25 125 150c junction capacitance vs reverse voltage 0.1 1 10 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz power derating curve 0 50 100 150 200 250 300 0 25 50 75 100 125 150 175 t a , ambient temperature() p d , power dissipation(mw) recommended footprint
cystech electronics corp. spec. no. : c335c2 issued date : 2013.02.05 revised date : page no. : 4/6 BAS21C2 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c335c2 issued date : 2013.02.05 revised date : page no. : 5/6 BAS21C2 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c335c2 issued date : 2013.02.05 revised date : page no. : 6/6 BAS21C2 cystek product specification sod-523 dimension 1 2 style : pin 1. cathode 2. anode 2-lead sod-523 plastic package cystek packa g e code : c2 marking code : 1 2 js *: typical millimeters inches millimeters inches dim min. max. min. max. dim min. min. max. min. max. a 0.510 0.770 0.020 0.031 e 1.100 1.300 0.043 0.051 a1 0.500 0.700 0.020 0.028 e1 1.500 1.700 0.059 0.067 b 0.250 0.350 0.010 0.014 e2 0.200 ref 0.008 ref c 0.080 0.150 0.003 0.006 l 0.010 0.070 0.001 0.003 d 0.750 0.850 0.030 0.033 7 ref 7 ref notes: 1.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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